IISc and Lam Research Pilot Successfully Upskills Engineers in Chip Making

IISc and Lam Research Pilot Successfully Upskills Engineers in Chip Making - thisweekindia

Bengaluru, May 10, 2024 – The Indian Institute of Science (IISc) announced the successful completion of a pilot program to train engineers in semiconductor fabrication technology.

The program, conducted in partnership with Lam Research, utilized Lam’s Semiverse Solutions™ platform to train 32 Master’s and PhD students at IISc’s Center for Nano Science and Engineering (CeNSE). Impressively, three graduates have already secured placements at leading global chip manufacturers.

This pilot builds on a collaboration between IISc and Lam Research, initiated in 2023, to develop a training program for Indian universities using Lam’s virtual fabrication software. Following the pilot’s success, IISc, Lam Research, and the India Semiconductor Mission have signed a Memorandum of Understanding (MoU) to expand the program nationwide. The ambitious goal is to upskill 60,000 engineers in the next decade.

“The pilot’s results are promising, and we are confident in the program’s national rollout,” said Professor Srinivasan Raghavan, Chair of CeNSE at IISc.

A key element of the training was SEMulator3D®, a powerful software for modeling chip design and fabrication processes. This industry-standard tool allows students to virtually experiment and optimize chip production, significantly reducing costs and environmental impact compared to traditional methods.

“This successful pilot paves the way for expanding the Semiverse™ learning platform across India,” said Rangesh Raghavan, Corporate Vice President and General Manager at Lam Research India. “We are committed to sharing specialized knowledge and supporting India’s semiconductor industry growth.”

Lam Research has collaborated with CeNSE since 2014, working on various projects to advance semiconductor technologies.

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